In the PCBA processing and assembly process, burst board is a relatively common PCB reliability defects, the burst board described here does not mean that the PCB board explosion, but refers to the PCB board to produce delamination or bubble phenomenon, in which the delamination refers to the separation of PCB board layer, and the bubble refers to the phenomenon of localized expansion of the PCB, resulting in the main reason for Na razponu plošče ima resno vlažno ploščo PCB, težave s materialom PCB in težave s krmiljenjem temperature.
Next, the main explanation of the PCB board is seriously affected by moisture: PCB substrate material is relatively easy to adsorb moisture, if the PCB board is not stored properly, and air contact for too long will lead to the PCB board to absorb too much moisture serious moisture, and in the PCBA welding process the temperature will be rapidly rising within a short period of time, with the rise in temperature, the board of the saturation vapor pressure of the water will also rise hitro in ko je nasičen parni tlak višji od vrednosti adhezije med ploščo, se bo pojavil, ko bo plošča počil pojav.
